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this device is an advanced direct conversion receiver for operation up to 470mhz. the design is based on the sl6609a but is specifically designed for use in very small pagers i.e. credit card sized, where local oscillator re-radiation is a problem. this design has overcome this difficulty. the device also includes a 1 volt regulator capable of sourcing up to 5ma, a battery flag and the facility of incorporating a more complex post detection filter off-chip. both battery flag and data outputs have open collector outputs to ease their interface with other devices. adjacent channel rejection is provided using tuneable gyrator filters. to assist operation in the presence of large interfering signals both rf and audio agc functions are provided. fig.2 block diagram of SL6610 features n very low power operation - typ 3.0mw n superior sensitivity of -130dbm n operation at wide range of paging data rates 512, 1200, 2400 baud n small package offering ssop n excellent performance of lo rejection applications n credit card pagers n watch pagers n small form factor pagers i.e. pcmcia ordering information SL6610 / kg / npds - ssop devices in anti-static sticks SL6610 / kg / npde - ssop devices in tape and reel 28 27 26 25 24 23 22 21 20 19 17 16 15 18 tpx mixer decouple loy gyri lox vr tpy gthadj tcadj bec tplimy vcc2 dataop battfl iagcout irfamp mixa gnd mixb vreg regcnt vcc1 vbatt vbg brf1 brf2 tplimx diggnd 1 2 3 4 5 6 7 8 9 10 12 13 14 11 np28 fig.1 pin connections absolute maximum ratings supply voltage 6v storage temperature -55? to +150? operating temperature -20? to +70? supersedes the october 1994 edition, ds4003 - 1.4 ds4003 - 2.2 september 1995 SL6610 direct conversion fsk data receiver advance information
SL6610 2 v v ma ? ? ? v v ? v ? ma ms ms ? ? ?rms ? ? max 2.8 3.5 1.8 700 1 8 1.05 1.27 20 1.07 10 5 600 9:7 500 1.0 min 0.95 1.8 0.95 1.15 0.93 0.25 400 40 7:9 100 21 13 21,27,28 11,13,14 21,27,28 11,13,14 23 19 19 6 6 17 27 14 14 14 vcc1 - supply voltage vcc2 - supply voltage icc1 - supply current icc2 - supply current power down icc1 power down icc2 1 volt regulator band gap voltage reference band gap current source voltage reference voltage reference sink/source 1 volt regulator load current turn on time turn off time detector output current rf current source current source (irf) decoder sensitivity output mark space ratio data o/p sink current data o/p leakage current electrical characteristics these characteristics are guaranteed over the following conditions unless otherwise stated: tamb = 25?, vcc1 = 1.3v, vcc2 = 2.7v characteristics pin comments value units 1.3 2.7 1.5 550 1.0 1.21 1.0 3 5 1 +/-4 500 typ vcc1 < vcc2 - 0.7 volts includes irf. does not include regulator supply. audio agc inactive batt flag & data o/p high pin 27 voltage: 0.3 - 1.3v i load = 3ma. ext pnp. ?>= 100, v ce = 0.1 volt vcc1 > 1.1v stable data o/p when 3db above sensitivity. c bg and c vr = 2.2? fall to 10% of steady state current c bg and c vr = 2.2? pin 27 voltage: 0.3 - 1.3v signal injected at tpx and tpy b.e.r. < 1 in 30 5khz deviation @ 1200 bits/sec brf capacitor = 1nf output logic low output iogic high
SL6610 3 v v ? ? ? ? db v ? 0.05 6 65 max 0.3 1 8 1 500 1 41 85 10 10 10 10 20 11 11 24, 26 3, 5 3, 5 28 electrical characteristics these characteristics are guaranteed over the following conditions unless otherwise stated: tamb = 25?, vcc1 = 1.3v, vcc2 = 2.7v characteristics pin comments value units typ min (v cc2 - 0.3) 50 34 45 battery economy input logic high input logic low input current input current battery flag input input current battery flag output battfl sink current battfl leakage current mixers gain to "if test" rf input impedance lo input impedance lo dc bias voltage audio agc max audio agc sink current powered up powered down powered up powered down transient initial ? (vbatt-vr) > 20mv (vbatt-vr) < -20mv lo inputs driven in parallel with 50mvrms @ 50mhz.if = 2khz see figs.8a, 8b see fig.9 equal to pin 21 (vcc1) min -130 52 68 -128 56 73 +/-2.3 +/-2.2 dbm db db khz khz sensitivity intermodulation adjacent channel centre frequency acceptance deviation acceptance characteristics pin comments max -125 typ value units 1200 bps d f = 4khz lo = -18dbm 1200 bps d f = 4khz lo = -18dbm 1200 bps d f = 4khz lo = -18dbm channel spacing 25khz 1200 bps d f = 4khz lo = -18dbm 1200 bps d f = 4khz lo = -18dbm receiver characteristics (demonstration board) measurement conditions unless stated v cc1 = 1.3v, v cc2 = 2.7v, lna = 18db power gain, 2db noise figure, carrier frequency 153mhz, ber 1 in 30, tamb = 25? (tpx/tpy typically:- 160mv pp ?10% for - 73dbm rf input to the lna)
SL6610 4 receiver characteristics (demonstration board) measurement conditions unless stated v cc1 = 1.3v, v cc2 = 2.7v, lna = 20db power gain, 2db noise figure, carrier frequency 282mhz, ber 1 in 30, tamb = 25? (tpx/tpy typically:- 160mv pp ?10% for - 73dbm rf input to the lna) min -128 50 67 -126 55.5 72.5 +/- 2.3 +/- 2.2 dbm db db khz khz sensitivity intermodulation adjacent channel centre frequency acceptance deviation acceptance characteristics pin comments max -123 typ value units 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm channel spacing 25khz 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm receiver characteristics measurement conditions unless stated v cc1 = 1.3v, v cc2 = 2.7v, lna = 22db power gain, 2db noise figure, carrier frequency 470mhz, ber 1 in 30, tamb = 25? (tpx/tpy typically:- 140mv pp ?10% for - 73dbm rf input to the lna) 1200 bps d f = 4khz 2400 bps d f = 4.5khz lo = -15dbm 1200 bps d f = 4khz 2400 bps d f = 4.5khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz 2400 bps d f = 4.5khz lo = -15dbm channel spacing 25khz 1200 bps d f = 4khz 2400 bps d f = 4.5khz lo = -15dbm 1200 bps d f = 4khz 2400 bps d f = 4.5khz lo = -15dbm -128 -125.5 56 53.5 52 72.5 69.5 +/-2.3 +/-2 +/-2.2 +/-2 min -130 52 49 47 67 64 +/-1.9 dbm dbm db db db khz khz sensitivity intermodulation (ip3) intermodulation (ip2) adjacent channel centre frequency acceptance deviation acceptance characteristics pin comments max -125 -122 typ value units
SL6610 5 receiver characteristics (demonstration board) measurement conditions unless stated lna = 18db power gain, 2db noise figure, carrier frequency 282mhz, ber 1 in 30, tamb = 0 to 45?, vcc2 = 2.7v, vcc1 = 1.2v to 1.6v (tpx/tpy typically:- 120mv pp ?10% for - 73dbm rf input to the lna) min 53 47 66 +/-1.8 -59 -52 db db db db khz khz khz dbm dbm sensitivity (desense from 25?, v cc 1 = 1.3v) intermodulation (ip3) intermodulation (ip2) adjacent channel centre frequency acceptance deviation acceptance lo rejection:- 0.5db sensitivity loss 3db sensitivity loss characteristics pin comments typ value units 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm channel spacing 25khz 1200 bps d f = 4khz lo = -15dbm 1200 bps d f = 4khz lo = -15dbm level of local oscillator at the rf input to the lna max 1.5 -44 58 53 72.5 +/-2.3 +/-2.2 -55 -48
SL6610 6 operation of SL6610 the SL6610 is a direct converson receiver designed for use up to 470mhz. it is available in a 28 pin ssop package and it integrates all the facilities required for the conversion of an rf fsk signal to a base-band data signal. low noise amplifier to achieve optimum performance it is necessary to incorporate a low noise rf amplifier at the front end of the receiver. this is easily biased using the on chip voltage and current sources provided. all voltages and current sources used for bias of the rf amplifier, receiver and mixers should be rf decoupled using suitable capacitors (see fig.4 for a suitable low-noise- amplifier). local oscillator the local oscillator signal is applied to the device in phase quadrature. this can be achieved with the use of two rc networks operating at the -3db/45?transfer characteristic, giving a full 90?phase differential between the lo ports of the device. each lo port of the device also requires an equal level of drive from the oscillator. (see fig.5). pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 pin description x channel pre-gyrator filter test-point. this can be used for input and output mixer bias de-couple pin lo input channel y gyrator current adjust pin lo input channel x vref 1.0 v internal signal ground y channel pre-gyrator filter test point, input or output audio agc gain and threshold adjust. rssi signal indicator audio agc time constant adjust battery economy control battery flag output y channel limiter (post gyrator filter) test point, output only supply connection data output pin x channel limiter (post gyrator filter) test point, output only bit rate filter 2, input to data output stage bit rate filter 1, output from detector digital ground bandgap voltage output battery flag input voltage supply connection 1v regulator control external pnp drive 1v regulator output voltage mixer input b ground mixer input a current source for external lna. value of current output will decrease at high mixer input signal levels due to rf agc audio agc output current pin name tpx mix-dec loy gyri lox vr tpy gthadj tcadj bec battfl tplimy vcc2 dataop tplimx brf2 brf1 dig gnd vbg vbatt vcc1 regcnt vreg mixb gnd mixa irfamp iagcout gyrator filters the on chip filters include an adjustable gyrator filter. this may be adjusted with the use of an additional resistor between pin 4 and gnd. this allows flexibility of filter characterstics and also allows for compensation for possible process variations. audio agc the audio agc fundamentally consists of a current sink which is controlled by the audio (baseband data) signal. it has three parameters that may be controlled by the user. these are the attack (turn on) time, decay (duration) time and threshold level (see fig.6 and 7). see application note for details. regulator the on chip regulator must be used in conjunction with a suitable pnp transistor to achieve regulation. as the transistor forms part of the regulator feedback loop the transistor should exhibit the following characteristics:- h fe > = 100 for v ce > = 0.1v
SL6610 7 fig.3 application circuit board
SL6610 8 components list for application board at 282mhz, 25khz channel spacing. c18 1n c19 100n c20 1n c21 1n c22 not used c23 1n c24 1n c25 1n c26 6p8 c27 1n c28 1n c29 100p c30 2u2 c31 2u2 c32 4p7 c33 4p7 c34 3p3 c35 not used vc1 1-10p vc2 1-10p vc3 1-10p inductors l1 68n (4) l2 not used (3) l3 470n l4 39n l5 680n active components q1 fmmt589 q2 2sc5065 (toshiba) q3 bft25a (philips) q4 not used q5 2sc5065 (toshiba) d1 panasonic ma862 (5) misc t1 30nh 1:1 coilcraft m1686-a xtal 5th overtone 94.075mhz (lo circuit in fig.3) resistors r1 open circuit r2 not used r3 100 r4 100k r5 1k r6 1k r7 100 r8 open circuit r9 220k r10 1m r11 100k (6) r12 not used r13 1k5 (1) r14 4k7 r15 4k7 r16 33k r17 not used r18 0r (3) r19 10k r20 620 r21 1k r22 open circuit capacitors c1 1n c2 2p7 c3 4p7 c4 1n c5 2p7 c6 2u2 c7 1n c8 100n c9 1n (2) c10 2u2 c11 100n c12 1n c13 1n c14 1n c15 1n c16 1n c17 1n c17a 1n notes 1. the values of r13 is determined by the set-up proce- dure. see application note. 2. the value of c9 is determined by the output data rate. use 2nf for 512bps, 1nf for 1200bps and 470pf for 2400bps. 3. l2 is used in the audio agc circuit (see fig. 6). for the characteristics of the audio agc current source see fig.7. if the audio agc is not required then the current source (pin 28) may be disabled by connecting pin 9 (tcadj) to vr (pin 6) and by connecting pin 28 (iagcout) to vcc1, (r18). the voltage at pin 8 may still be used as an rssi. r9, c8, c14, c19, r17 and d1 may then be omitted. see fig.6 for agc component values. 4. l1and c26 form the low noise matching network for the rf amplifier. the values given are for the rf amplifier specified in the applications circuit with no audio agc connected. i.e. r17 and d1 omitted. 5. suggested diode for use with the audio agc circuit (see fig.6) (d1 is not included on the general demon- stration circuit). 6. the value of r11 is dependent on the data output load. r11 should allow sufficient current to drive the data output load.
SL6610 9 components list for application board at 470mhz, 25khz channel spacing. (lo circuit is 50 w network as in fig.5 - crystal oscillator not specified) resistors r1 open circuit r2 not used r3 100 r4 100k r5 100 r6 100 r7 100 r8 open circuit r9 220k r10 1m r11 100k (2) r12 300 (3) r13 3k9 (1) r14 4k7 r15 4k7 r16 33k r17 open circuit (4) r18 0r (4) r22 open circuit capacitors c1 1n c2 3.3pf c3 1n c4 1n c5 3.9pf c6 2u2 c7 1n c8 100n c9 1n (2) c10 2u2 c11 100n c12 1n c13 1n c14 1n c15 1n c16 1n c17 1n c18 1n c19 100n c20 1n c21 1n c22 not used c23 not used c24 1n c25 1n c26 open circuit c27 not used c28 not used c29 100p c30 2u2 c31 2u2 c34 1p5 vc1 1-3pf inductors l1 47nh (5) l2 not used (3) t1 16nh 2 turn 1:1 (coilcraft) q4123-a active components q1 zetex fmmt589 q2 philips bft25a q3 not used q4 philips bft25a (3) q5 philips bft25a d1 panasonic ma862 (6) notes 1. the values of r13 is determined by the set-up proce- dure. see application note. 2. the value of "c9" is determined by the output data rate. use 2nf for 512bps, 1nf for 1200bps and 470pf for 2400bps. 3. r12 & q4 form a dummy load for the regulator. permitted load currents for the regulator are 250? to 5ma. the 1v regulator (output pin 23) can be switched off by connecting pin 23 directly to vcc2. q1, q4, r12 and c12 must then be omitted 4. l2 is used in the audio agc circuit (see fig.6). for the characteristics of the audio agc current source see figure 7. if the audio agc is not required then the current source (pin 28) may be disabled by connecting pin 9 (tcadj) to vr (pin 6) and by connecting pin 28 (iagcout) to vcc1, (r18). the voltage at pin 8 may still be used as an rssi. r9, c8, c14, c19, r17 and d1 may then be omitted. 5. l1and c26 form the low noise matching network for the rf amplifier. the values given are for the rf amplifier specified in the applications circuit with no audio agc connected. i.e. r17 and d1 omitted. 6. suggested diode for use with the audio agc circuit (d1 is not included on the general demonstration circuit). 7. the value of r11 is dependent on the data output load. r11 should allow sufficient current to drive the data output load.
SL6610 10 fig.4 rf amplifier rf amplifier components values resistors capacitors r14, r15 4k7 c13, c15 1nf active components r13 see note 1 c16, c17 1nf d1 ma862 (panasonic) r22 47k c20, c21 1nf see note 2 c24, c25 1nf l2 820nh notes: (1) the value of r13 is determined by the set up procedure (see "set up for optimum performance"). (2) c20 and c21 are purely for deomonstration purposes. pin 24 and pin 26 may be dc coupled provided that no dc voltage is applied to the mixer inputs. frequency dependent components 153mhz 280mhz 450mhz c26 not used 6.8p not used c27 not used not used not used l1 150nh 68nh 39nh c34 3p3 2p2 1p5 t1 100nh 30nh 16nh coilcraft n2261-a coilcraft m1686-a coilcraft q4123-a vc1 1-10pf 1-10pf 1-3pf q4, q5 toshiba 2sc5065 toshiba 2sc5065 philips bft25a (see also lo drive network) fig.5 local oscillator drive network higher input impedance (crystal oscillator input) 153mhz 280mhz 450mhz c3 set by load allowable on crystal oscillator (typical 4p7) c2 10p 5p6 3p3 c5 10p 5p6 3p9 r3 100 100 100 r7 100 100 100 r5, r6 = 1k c4, c18 = 1n lo drive network component values 50ohm input impedance (external lo injection) 153mhz 280mhz 450mhz c2 10p 5p6 3p3 c5 10p 5p6 3p9 c3, c4, c18 = 1n r3, r5, r6, r7 = 100ohms
SL6610 11 fig.6 agc schematic fig.7 audio agc current vs. ip power at 25?
SL6610 12 fig.8a sl6609a mixer a input s-parameters fig.8b sl6609a mixer b input s-parameters fig.9 sl6609a lo x,y inputs s-parameters 50mhz 1ghz .2 .5 1 2 50mhz .2 .5 1 2 1ghz 50mhz .2 .5 1 2 1ghz freq 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 mag 0.969 0.958 0.942 0.917 0.893 0.858 0.832 0.806 0.781 0.755 0.743 0.725 0.703 0.680 0.666 0.653 0.636 0.615 0.604 0.600 ang -7.20 -14.45 -20.59 -26.40 -33.26 -39.84 -44.78 -49.01 -54.00 -59.53 -64-35 -68.43 -73.01 -78.74 -83.76 -87.48 -91.32 -97.17 -102.84 -105.23 s11 freq 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 mag 0.970 0.960 0.945 0.919 0.902 0.872 0.850 0.825 0.803 0.776 0.760 0.739 0.717 0.698 0.683 0.666 0.659 0.647 0.637 0.634 ang -7.06 -13.83 -19.90 -25.70 -32.18 -38.03 -43.07 -48.27 -53.58 -58.49 -63.08 -67.98 -72.63 -76.96 -81.09 -85.49 -89.51 -93.90 -98.42 -102.40 s11 freq 50.000 100.000 150.000 200.000 250.000 300.000 350.000 400.000 450.000 500.000 550.000 600.000 650.000 700.000 750.000 800.000 850.000 900.000 950.000 1000.00 mag 0.993 0.995 0.997 0.997 0.996 0.986 0.965 0.936 0.902 0.872 0.838 0.804 0.798 0.810 0.784 0.779 0.790 0.788 0.768 0.743 ang -4.17 -8.43 -12.88 -17.57 -22.63 -28.16 -33.87 -39.17 -43.88 -48.54 -52.81 -56.60 -59.47 -65.19 -71.49 -75.97 -82.54 -91.16 -100.20 -108.52 s11
SL6610 13 vcc1 = 1.0v, vcc2 = 1.8v vcc1 = 1.3v, vcc2 = 2.7v vcc1 = 3.0v, vcc2 = 4.0v conditions:- 282mhz demonstration board i.e. 20db lna, 2db noise figure, carrier frequency 282mhz, 1200bps baud rate, 4khz deviation frequency, ber 1 in 30. fig.10a ac parameters vs. supply and temperature
SL6610 14 vcc1 = 1.0v, vcc2 = 1.8v vcc1 = 1.3v, vcc2 = 2.7v vcc1 = 3.0v, vcc2 = 4.0v conditions:- 282mhz demonstration board i.e. 20db lna, 2db noise figure, carrier frequency 282mhz, 1200bps baud rate, 4khz deviation frequency, ber 1 in 30. fig.10b ac parameters vs. supply and temperature
SL6610 15 vcc1 = 0.98v, vcc2 = 1.78v vcc1 = 1.3v, vcc2 = 2.7v vcc1 = 3.0v, vcc2 = 4.0v fig.11 dc parameters vs. supply and temperature (ip3 vs audio agc both on and off) note 1- ip3 is level above wanted needed to reduce receiver to 1 in 30 b.e.r. conditions:- icc1 includes 500? lna current but does not include the regulator supply (audio agc inactive). icc2 measured with batt flag and data o/p high, fc = 282mhz.
SL6610 16 fig.12 sensitivity, ip3 vs receiver gain fig.13 sensitivity, adjacent channel vs receiver gain
SL6610 17 fig.14 sensitivity, ip3 vs lo level fig.15 sensitivity, adjacent channel vs lo level 282mhz, 1200bps, 4khz deviation -129 -128 -127 -126 -125 -124 -123 -122 -25 -23 -21 -19 -17 -15 -13 -11 -9 -7 -5 lo drive level (dbm) sensitivity (dbm) 52 53 54 55 56 ip3 (db) sensitivity ip3 -129 -128 -127 -126 -125 -124 -123 -122 -25 -23 -21 -19 -17 -15 -13 -11 -9 -7 -5 lo drive level (dbm) sensitivity (dbm) 71 71.5 72 72.5 73 73.5 adj. channel (db) sensitivity acr
SL6610 18 package details dimensions are shown thus: mm (in) internet: http://www.gpsemi.com customer service centres l france & benelux les ulis cedex tel: (1) 69 18 90 00 fax : (1) 64 46 06 07 l germany munich tel: (089) 419508-20 fax : (089) 419508-55 l italy milan tel: (02) 6607151 fax: (02) 66040993 l japan tokyo tel: (03) 5276-5501 fax: (03) 5276-5510 l korea seoul tel: (2) 5668141 fax: (2) 5697933 l north america scotts valley, usa tel: (408) 438 2900 fax: (408) 438 5576/6231 l south east asia singapore tel:(65) 3827708 fax: (65) 3828872 l sweden stockholm tel: 46 8 702 97 70 fax: 46 8 640 47 36 l taiwan, roc taipei tel: 886 2 25461260 fax: 886 2 27190260 l uk, eire, denmark, finland & norway swindon tel: (01793) 726666 fax : (01793) 518582 these are supported by agents and distributors in major countries world-wide. ?mitel corporation 1998 publication no. ds4003 issue no. 2.2 september 1995 technical documentation ?not for resale. printed in united kingdom headquarters operations mitel semiconductor cheney manor, swindon, wiltshire sn2 2qw, united kingdom. tel: (01793) 518000 fax: (01793) 518411 mitel semiconductor 1500 green hills road, scotts valley, california 95066-4922 united states of america. tel (408) 438 2900 fax: (408) 438 5576/6231 this publication is issued to provide information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. no warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. the company reserves the right to alter without prior notice the specification, design or price of any product or service. information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. it is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. these products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. all products and materials are sold and services provided subject to the company's conditions of sale, which are available on request. all brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
www.zarlink.com information relating to products and services furnished herein by zarlink semiconductor inc. or its subsidiaries (collectively ?zarlink?) is believed to be reliable. however, zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from t he application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. neither the supply of such information or purchase of product or service conveys any license, either express or implied, u nder patents or other intellectual property rights owned by zarlink or licensed from third parties by zarlink, whatsoever. purchasers of products are also hereby notified that the use of product in certain ways or in combination with zarlink, or non-zarlink furnished goods or services may infringe patents or other intellect ual property rights owned by zarlink. this publication is issued to provide information only and (unless agreed by zarlink in writing) may not be used, applied or re produced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. the products, t heir specifications, services and other information appearing in this publication are subject to change by zarlink without notice. no warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. it is the user?s responsibility t o fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not b een superseded. manufacturing does not necessarily include testing of all functions or parameters. these products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. all products and materials are sold and services provided subject to zarlink?s conditi ons of sale which are available on request. purchase of zarlink?s i 2 c components conveys a licence under the philips i 2 c patent rights to use these components in and i 2 c system, provided that the system conforms to the i 2 c standard specification as defined by philips. zarlink, zl and the zarlink semiconductor logo are trademarks of zarlink semiconductor inc. copyright zarlink semiconductor inc. all rights reserved. technical documentation - not for resale for more information about all zarlink products visit our web site at

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